Samsung’s Exynos 2600 SoC may get Heat Pass Block for better cooling: Report

samsung exynos

Samsung’s next-generation Galaxy S26 smartphones are likely to be powered by the Exynos 2600 SoC, which is tipped to be the world’s first commercially available chipset produced using the 2nm fabrication process technology. Recent benchmark tests have suggested that the processor could even beat last year's Snapdragon 8 Elite chip numbers, especially in graphical performance. Now, a new report suggests that the Exynos 2600 SoC could be equipped with a new component that will make it easier to cool down the chipset, providing improved performance.

Samsung Exynos 2600 to provide better heat management

According to a report by ZDNet Korea, Samsung has developed a cool new trick for the Exynos 2600 SoC, which is called Heat Pass Block (HPB), and promises to cool the application processor (AP) better than previous approaches. It is pretty different from the existing Exynos 2500 chipset structure, where the DRAM is placed directly on top of the SoC, and instead, both the HPB and the DRAM will sit directly on the Exynos 2600, with the new component working as a heatsink to facilitate better heat transfer.

This would theoretically result in the processor being able to reach higher clock speeds and maintain peak performance longer, depending on how much heat the HPB can dissipate. Moreover, Samsung could add Fan-out Wafer Level Packaging (FOWLP) to improve heat resistance to deliver improved heat distribution, and increase multi-core performance.

The report also adds that Samsung aims to complete quality testing for the Exynos 2600 chipset with this new technology by October. Therefore, the mass production and introduction of the Exynos 2600 could be done by the end of this year and just in time before the company’s Galaxy S26 family is announced in early 2026.