MediaTek Dimensity 6400 chipset announced with minor improvements over its predecessor

MediaTek Dimensity 6400

Popular Taiwanese chipmaker MediaTek has released the Dimensity 6400 SoC for entry-level smartphones, succeeding the Dimensity 6300 SoC from last year. It is manufactured on Taiwan Semiconductor Manufacturing Company’s (TSMC) 6nm fabrication technology, providing a balance between efficiency and performance at a budget cost for OEMs. It also supports up to 108MP cameras, a 120Hz Full-HD display, and offers 5G connectivity.

MediaTek Dimensity 6400: Specifications and features

The new MediaTek Dimensity 6400 is an octa-core 6nm chipset, which comprises two Arm Cortex-A76 cores clocked at 2.5GHz and six Cortex-A55 cores clocked at 2GHz. The core configuration matches both the Dimensity 6300 and Dimensity 6100+ chipsets, offering slightly slower performance cores clocked at 2.4GHz and 2.2GHz, respectively.

It is also equipped with the same Arm Mali-G57 MC2 GPU like its predecessors and supports LPDDR4x RAM and UFS 2.2 storage. Further, it can handle displays with resolutions up to 1080p+ (Full HD+) at a refresh rate of up to 120Hz and supports 10-bit colour depth. The Dimensity 6400 comes with an Image Signal Processor (ISP) that supports up to 108MP cameras. In terms of connectivity, the Dimension 6400 has a 3GPP Release-16 compliant 5G modem, with up to 3.3Gbps peak download speed.

Moreover, it offers 5G (SA/ NSA), 4G LTE, 3G and 2G connectivity. In terms of modem support, it has Wi-Fi 5, Bluetooth 5.2, and dual-band GPS connectivity. The newly launched  Realme P3x 5G is one of the first devices powered by this new chipset.