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Apple iPhone 17 Pro Max expected to get a major material change

The Apple iPhone 17 Pro Max, which is expected to launch this year, could feature a redesigned aluminum frame, a larger camera island, and the A19 Pro chipset. The company is also expected to introduce iPhone 17 Air with a slimmer design.

March 11, 2025 / 22:20 IST
iPhone 17 Pro Max

iPhone 17 Pro Max

The iPhone 17 series is one of the most widely anticipated launches of 2025, with multiple leaks giving us a glimpse of what Apple has in store for its next-gen flagship smartphones. Rumours are buzzing about major design changes, and while Apple has yet to confirm the details, many leaks have revealed some of the key upgrades of the iPhone 17 Pro Max, including the specifications, design, and other enhancements.

iPhone 17 Pro Max: Expected design, processor

Apple first introduced the titanium-bodied iPhones with the iPhone 15 Pro and 15 Pro Max models in 2023. This new material is claimed to offer greater durability and a lighter form factor. However, according to industry analysts such as Jeff Pu and Ming-Chi Kuo, with the upcoming iPhone 17 Pro Max, Apple is now reportedly planning to switch back to aluminium frames.

Moreover, according to leaks, Apple will adopt a part-glass and part-aluminium back design, replacing the all-glass back seen in current smartphones. Moreover, a switch to an aluminum frame is said to align with Apple’s 2030 carbon neutrality goals, as aluminium offers a lower carbon footprint compared to titanium.

Further, the iPhone 17 Pro Max may get a new camera bump with a darker shade housing the triple camera setup. Additionally, the flash LiDAR sensor is expected to be shifted towards the right. According to a report by leaker Ice Universe, the iPhone 17 Pro Max could measure 8.725mm, compared to the 8.25mm thickness of the iPhone 16 Pro Max, allowing the Cupertino-based tech giant to include a larger battery in the device.

Under the hood, the iPhone 17 Pro Max is expected to be powered by Apple’s next-generation A19 Pro chip, built on TSMC’s advanced 3nm process. This chipset is expected to deliver powerful performance and improved power efficiency. Further, the device is anticipated to have 12GB of RAM, which would be a significant jump from the 8GB found in the current model.

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Sandip Chakraborty
first published: Mar 11, 2025 10:20 pm

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