Less paperwork, more wafer work: PM Modi at Semicon 2025

Less paperwork, more wafer work: PM Modi at Semicon 2025

Prime Minister Narendra Modi on September 2 said that in the semiconductor industry “speed matters” and emphasised that “the less there is paperwork, the more there will be wafer work.”

Speaking at the inauguration of the fourth edition of Semicon India at the Yashobhoomi Convention Centre in New Delhi, Modi announced that the next phase of the India Semiconductor Mission was being rolled out. He urged startups, academia, and state governments to actively participate in building a globally competitive semiconductor ecosystem.

“Our journey in this sector began late, but nothing can stop us now,” he said, adding that commercial chips would roll out of India this year. Modi highlighted that 10 semiconductor projects worth $18 billion are underway, reflecting global confidence in India’s ability to offer end-to-end capabilities in the chip ecosystem.

He also pointed to the launch of the National Critical Material Mission, aimed at securing access to essential inputs, and stressed the importance of ensuring that intellectual property developed in the sector remains in India.

India’s semiconductor ambitions got a renewed push with government schemes introduced over the past two years. Last week, CG Semi—a joint venture between CG Power and Japan’s Renesas—began its OSAT facility’s pilot line, where the country’s first Made in India chip will be produced. Other players, including Micron and Kaynes Technology, are also moving forward with their facilities.

This edition of Semicon is the country’s largest, featuring nearly 350 exhibitors from 33 countries, participation from nine Indian states, six country roundtables, and four country pavilions. Modi is scheduled to attend a CEO’s roundtable at the venue on Tuesday.