
US semiconductor major Qualcomm Technologies has signed an agreement with Tata Electronics to manufacture Qualcomm Automotive Modules at Tata’s upcoming semiconductor assembly and test facility in Assam, the companies said on February 20.
Under the partnership, production will take place at Tata Electronics’ OSAT (outsourced semiconductor assembly and test) plant in Jagiroad. The move aligns with the Centre’s ‘Make in India’ push and marks Tata Electronics’ entry into Qualcomm’s global network of automotive module manufacturing partners.
The collaboration is aimed at meeting rising global demand for modular automotive platforms. By localising production, the companies expect to serve both Indian and international automakers while improving supply chain resilience and geographic diversification.
Qualcomm Automotive Modules combine the company’s Snapdragon Digital Chassis system-on-chips (SoCs) with key system components into ready-to-deploy modules. These modules support applications such as digital cockpits, infotainment, connectivity and advanced vehicle intelligence systems.
The companies said the modules are designed to help automakers transition toward software-defined vehicles through scalable, integrated architectures.
Nakul Duggal, Executive Vice President and Group General Manager for Automotive, Industrial and Embedded IoT at Qualcomm Technologies, described the agreement as a milestone in the company’s automotive growth strategy, noting that expanding regional manufacturing capacity is critical as the industry shifts toward module-based designs.
Savi Soin, Senior Vice President and President of Qualcomm India, said manufacturing in India would enhance the company’s ability to support original equipment manufacturers (OEMs) with greater flexibility.
Randhir Thakur, CEO and Managing Director of Tata Electronics, said the partnership strengthens the company’s ambition to position itself as a global hub for high-technology manufacturing. He added that Tata Electronics would leverage its Integrated Systems Packaging capabilities to deliver high-performance products for Qualcomm’s automotive portfolio.
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