Intel CEO Lip-Bu Tan says company 'committed to support India Semiconductor Mission' after meeting PM Modi

Intel CEO Lip-Bu Tan with PM Modi

Intel Chief Executive Lip-Bu Tan on December 9 said the company is committed to support the India Semiconductor Mission (ISM), following a meeting with Prime Minister Narendra Modi in New Delhi.

Tan said the two discussed “technology, computing and the tremendous potential for India". He added that he applauds the government for putting in place a “comprehensive semiconductor design and manufacturing policy.”

"Glad to have met Mr. Lip-Bu Tan. India welcomes Intel’s commitment to our semiconductor journey. I am sure Intel will have a great experience working with our youth to build an innovation-driven future for technology," Modi said in a response to Tan's tweet on X.

However, the tweets did not detail specific investment or collaboration plans. The statement also comes as the government seeks global partnerships to accelerate domestic chip capacity and reduce import dependence across electronics, telecom and strategic sectors.

Read: Microsoft commits $17.5 billion for India’s AI buildout after Satya Nadella meets PM Modi

Intel-Tata Electronics tie-up

Separately, Tan also said Intel has entered a “wide-ranging strategic alliance” with the Tata Group, calling it a step toward strengthening the silicon and compute ecosystem in India.

He said Intel looks forward to working closely with Tata Sons chairman N. Chandrasekaran and Tata Electronics chief Randhir Thakur.

This meeting comes a day after Tata Electronics announced that it has secured Intel as a prospective customer for its upcoming chip facilities. The electronics-manufacturing arm of Tata group is investing about $14 billion to build India's first semiconductor fabrication facility in Gujarat and a chip assembly and testing facility in the state of Assam.

The government is currently working on the next phase of its chip initiative — widely referred to as India Semiconductor Mission 2.0 — which aims to move beyond isolated fab announcements and build a full-stack semiconductor ecosystem.

Officials expect the upgraded mission to widen incentives towards chip design, advanced packaging (ATMP/OSAT), and critical materials such as silicon carbide, while placing greater emphasis on supply-chain and vendor networks.