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American chipmaker Qualcomm tapes out 2 nm chip design from India centers 

The breakthrough, developed with key contributions from Qualcomm’s engineering centres in Bengaluru, Chennai and Hyderabad, reinforces India’s rising stature as a global hub for cutting-edge chip design.

February 07, 2026 / 13:31 IST
Qualcomm
Snapshot AI
  • Qualcomm finishes 2nm chip design via India centers in Bengaluru, Chennai, Hyderabad
  • India becomes Qualcomm's largest chip design hub outside the US.
  • Milestone supports India's goal to be a global semiconductor innovation hub.

In a significant boost to India’s semiconductor ambitions, Qualcomm Technologies on Saturday announced the successful tape-out of its 2-nanometre chip design through its India engineering centers in Bengaluru, Chennai and Hyderabad.

The breakthrough, developed with key contributions from Qualcomm’s engineering centres in Bengaluru, Chennai and Hyderabad, reinforces India’s rising stature as a global hub for cutting-edge chip design.

The company said the achievement reflects the depth of its India engineering footprint, now its largest outside the United States, and highlights the country’s expanding role in advanced semiconductor innovation.

The milestone was showcased at Qualcomm’s Bengaluru facility during a visit by Ashwini Vaishnaw, Union Minister for Railways, Information & Broadcasting, and Electronics & IT.

“India is increasingly at the center of how advanced semiconductor technologies are being designed for the future,” Vaishnaw said, calling the development a testament to the growing maturity of the country’s design ecosystem and aligned with its ambition to build a globally competitive semiconductor industry.

With more than two decades of continuous investment in India, Qualcomm has built deep capabilities spanning wireless, compute, artificial intelligence and system-level engineering. Its India teams contribute across design implementation, validation, AI optimisation and system integration, supporting global architecture and platforms that power billions of devices worldwide.

Srini Maddali, Senior Vice President, Engineering at Qualcomm India, described the 2nm tape-out as a validation of the engineering depth in the country. “Working closely with global program and architecture teams on advanced semiconductor design requires the very best talent, and our India teams consistently deliver at a global standard,” he said.

Qualcomm said its India R&D centres now contribute across multiple layers of system design -- from architecture to software platforms and AI-driven use-case optimisation -- particularly critical in the era of intelligent and connected systems.

The successful 2nm tape-out comes at a time when India is accelerating efforts to position itself as a global semiconductor hub through policy support, ecosystem incentives and industry partnerships. Qualcomm’s latest milestone adds momentum to that push, signalling that India is not just assembling chips for the world, but increasingly helping design the future of them.

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Danish Khan
Danish Khan is the editor of Technology and Telecom. He was previously with the Economic Times and has tracked the sector for 14 years.
first published: Feb 7, 2026 01:30 pm

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