HMD is reportedly working on the second generation of its modular smartphone platform, dubbed HMD Fusion 2. The device is expected to succeed the first-generation HMD Fusion, which recently debuted in India. Ahead of the official announcement, leaked information posted on X reveals a set of hardware upgrades and new modular outfits that will form part of the device’s headline proposition.
Key features and leaked specifications
According to leaks shared by HMD Meme on X, the HMD Fusion 2 is tipped to feature Smart Outfits Gen 2 with Pogo Pin 2.0 connectivity for snap-on modules. These accessories attach through six pogo pins placed on the rear panel of the phone.
The leak further highlights a 6.58-inch OLED display with Full HD+ resolution and a 120Hz refresh rate. Powering the device is said to be Qualcomm’s Snapdragon 6s Gen 4 chipset.
On the optics front, the handset is rumoured to include a dual-rear camera setup with a 108-megapixel primary sensor supported by OIS, paired with an 8-megapixel ultra-wide camera. Other reported additions include dual speakers, Bluetooth 5.3, a 3.5mm audio jack and an IP65 rating.
New Smart Outfits and compatibility
The tipster also suggests that HMD will introduce a wider range of modular outfits this time, which may include options such as a Kickstand Casual Outfit, Wireless Charging Outfit, Rugged Outfit, Gaming Outfit, Camera Grip Outfit, Flashy Outfit, Speaker Outfit, QR/Barcode Outfit and Smart Projector Outfit. However, the leak also claims the new Smart Outfits will not be compatible with the first-generation Fusion model, indicating a revision to the pin layout or module standard.
Launch status
The leaks do not cite any timelines or regions for launch. HMD has not issued any official confirmation regarding Fusion 2, its modular accessories, or rollout plans at the time of writing.
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