Making its first appearance on the Asus ROG Maximus V Formula gaming and overclocking motherboard, Fusion Thermo combines improved passive air heat dissipation with liquid cooling readiness. It represents another ROG exclusive, and the first such design on any commercially-available motherboard. Asus has applied for a Fusion Thermo patent, and the feature has garnered official endorsement from ten of the most renowned makers of liquid cooling hardware, including Swiftech and EKWB. Fusion Thermo offers customers the utmost thermal flexibility and efficiency for intense gaming, overclocking, and case modding. Click here for full story
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