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Govt considers 10 chipmaking proposals under $10 billion incentive scheme

Next edition of India's annual semiconductor conference to be held in Delhi in September 2024

September 14, 2023 / 12:09 IST
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The Indian government is considering 10 applications by chipmakers under a $10 billion capex-linked incentive scheme, with two of the proposals being for silicon fabs, three for compound semiconductor fabs, and five for packaging chips, a senior official said on September 13.

After the joint venture between Vedanta and Foxconn ended, both the Indian natural resources company and the Taiwanese major have submitted separate applications to set up fabs in India. However, both are now looking for technology partners before moving forward, and the government is currently reviewing their proposals.

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The curtain-raiser for the next edition of the annual semiconductor conference was held in Bengaluru yesterday. The last edition of the conference was held in Gandhinagar, Gujarat in August and was led by the Indian government. The next edition of the event, which will be held in September 2024 in New Delhi, will be led by chip industry body SEMI (Semiconductor Equipment and Materials International).

Speaking to Moneycontrol, Ajit Manocha, the CEO of SEMI and a member of the advisory committee for India's Semiconductor Mission, said that in the past, policies did not support the setting up of a fab in India, but they now do.