Apple A20 Chips in iPhone 18 models rumoured to feature new design
Apple’s upcoming A20 chips for the iPhone 18 series are expected to feature a new design, moving away from TSMC’s current InFO packaging. Some chips will integrate RAM directly on the same wafer as the CPU, GPU, and Neural Engine, improving performance and power efficiency for longer battery life. Manufactured using TSMC’s advanced 2nm process, these changes are likely to benefit higher-end models launching in late 2026, with lower-end versions arriving in early 2027. Overall, the A20 represents a significant upgrade in Apple’s chip technology for the next iPhones.
New Chip Packaging Approach Apple is expected to move away from TSMC’s current InFO (Integrated Fan-Out) packaging for its A20 chips, aiming for a fresh design.
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Launch Timeline Unclear The design change may apply only to higher-end models like the iPhone 18 Pro and the anticipated foldable iPhone 18, expected in the second half of 2026. Lower-end models, such as the standard iPhone 18 and iPhone 18 Air, might launch in spring 2027.
Integrated RAM on Wafer Some A20 chips will reportedly integrate RAM directly on the same wafer as the CPU, GPU, and Neural Engine, instead of using adjacent chips connected by a silicon interposer.
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Benefits of Integration This integration could boost overall performance and Apple Intelligence tasks while improving power efficiency, resulting in longer battery life.
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Smaller Chip Size The A20 chip’s new design may reduce the space it occupies inside the iPhone, allowing more efficient internal layouts.
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Advanced Manufacturing Process A20 chips are likely to be built using TSMC’s 2nm process, enhancing speed and efficiency compared to the A18 and A19 chips, which use 3nm fabrication.
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Significant Underlying Changes The A20 chip marks a substantial step forward in Apple’s chip technology for the iPhone 18 series, promising improved performance and battery life.
