HomeNewscompaniesNirmala Sitharaman hails semiconductor plant; says Assam tops utilisation of special central fund

Nirmala Sitharaman hails semiconductor plant; says Assam tops utilisation of special central fund

The Morigaon semiconductor facility is part of a wider network of government-backed projects aimed at bolstering India’s semiconductor production capabilities

November 07, 2025 / 21:52 IST
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Sitharaman reached Guwahati in the morning on a two-day tour, during which she is scheduled to unveil a range of projects across different places of the state
Sitharaman reached Guwahati in the morning on a two-day tour, during which she is scheduled to unveil a range of projects across different places of the state

Stating that Tata Group’s upcoming semiconductor plant will put Assam in the driver seat of the engine for developed India, Union Finance Minister Nirmala Sitharaman on Friday said the state tops the list in the country for maximum utilisation of special central fund to create capital assets.

Sitharaman reached Guwahati in the morning on a two-day tour, during which she is scheduled to unveil a range of projects across different places of the state.”The centre gives funds to every state under the Special Assistance to States for Capital Investment (SASCI) scheme to build capital assets like hospitals, roads and other infrastructure.

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Assam also gets it,” she said while inaugurating the Brahmaputra riverfront project here.The money is given to the states as 50-year interest-free loans to boost the states’ capital expenditure, Sitharaman said.”The way Assam is planning to create assets, it is utilising the central fund to the maximum level. Assam tops the list,” she added.

Although all states are creating assets, nobody is doing it like Assam is working, the Union Finance Minister said in her speech.In the afternoon, she visited the upcoming facility of Tata Electronics’ Outsourced Semiconductor Assembly and Test (OSAT), situated at Jagiroad in Morigaon district of central Assam.With an investment of Rs 27,000 crore, the facility is expected to produce up to 48 million semiconductor chips per day, employing advanced packaging technologies like flip chip and Integrated System in Package (ISIP).