HomeNewsBusinessExpect chip plants' groundbreaking in 18-24 months: Rajeev Chandrasekhar

Expect chip plants' groundbreaking in 18-24 months: Rajeev Chandrasekhar

We will be the hub of talent for the global electronics ecosystem, says Union Minister

October 27, 2022 / 09:56 IST
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Union Minister Rajeev Chandrasekhar.
Union Minister Rajeev Chandrasekhar.

Driven by the government's semiconductor subsidy scheme, India expects to see the groundbreaking of up to two fabs and packaging units in the next 18-24 months, said Union Minister Rajeev Chandrasekhar.

“We not only have a blueprint in terms of semiconductor research, design and manufacturing, but also an approach to integrate higher education with it and develop a talent strategy. We will be the hub of talent for the global electronics ecosystem,” Chandrasekhar said at a technology conference in Delhi on October 26.

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The minister of state for electronics and information technology also highlighted that he has asked information technology ministers of states to wake up to opportunities in emerging areas of technology.

He said that there was a lot of competition between states to attract chipmakers – and how Gujarat clinched the deal in one case by giving a top-up subsidy over the amount that the Centre has promised in its incentive scheme.